Optical module and method of making the same

ABSTRACT

An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/683,117 filed Nov. 13, 2019, now issued as U.S. Pat. No. 11,262,197,which is a continuation of U.S. patent application Ser. No. 14/975,083filed Dec. 18, 2015, now issued as U.S. Pat. No. 10,508,910 which claimsthe benefit of P.R.C. (China) Patent Application No. 201410802251.1filed on Dec. 22, 2014, the contents of which are incorporated herein byreference in their entirety.

BACKGROUND 1. Field

The present disclosure relates to an optical module and a method ofmaking an optical module. The optical module can be used, for example,in electronic products such as mobile phones, digital cameras and tabletcomputers.

2. Description of the Related Art

An optical module, for example, a proximity sensor, can be used to senseobjects near the optical module. The optical module has a lightingsource and an optical sensor, and the optical sensor can receive orsense the light (for example, infrared) emitted by the lighting sourceand reflected by external or nearby objects, to detect a presence ofexternal adjacent objects.

SUMMARY

An optical module includes a carrier; an optical element disposed on theupper side of the carrier; and a housing disposed on the upper side ofthe carrier, the housing defining an aperture exposing at least aportion of the optical element, an outer sidewall of the housingcomprising at least one singulation portion disposed on the upper sideof the carrier, wherein the singulation portion of the housing is afirst portion of the housing, and wherein the housing further comprisesa second portion and a surface of the singulation portion of the housingis rougher than a surface of the second portion of the housing.

An optical module includes: a carrier; an optical element disposed onthe upper side of the carrier; a housing disposed on the upper side ofthe carrier, the housing defining an aperture exposing at least aportion of the light source or the optical sensor, an outer sidewall ofthe housing comprising at least one singulation portion disposed on theupper side of the carrier; and an adhesive disposed between the housingand the carrier.

A method of making an optical module includes: providing at least onehousing matrix module, wherein the housing matrix module comprises aplurality of housings connected with each other, and wherein eachhousing defines an aperture; singulating the housing matrix module toseparate the housings from each other, wherein the singulating defines asingulation portion on an outer sidewall of each of the housings;disposing a plurality of optical elements at an upper side of a carrier;disposing the singulated housings on the upper side of the carrier, eachhousing positioned over at least one optical element; and singulatingthe carrier into a plurality of optical modules, the singulation portionbeing disposed on an upper surface of the carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view of an embodiment of an opticalmodule according to the present disclosure;

FIG. 2 is a schematic sectional view of an embodiment of an opticalmodule according to the present disclosure;

FIG. 3 is a schematic sectional view of an embodiment of an opticalmodule according to the present disclosure;

FIG. 4 is a schematic sectional view of an embodiment of an opticalmodule according to the present disclosure;

FIG. 5 is a schematic sectional view of an embodiment of an opticalmodule according to the present disclosure;

FIG. 6 is a schematic sectional view of an embodiment of an opticalmodule according to the present disclosure;

FIG. 7 is a schematic view of a step type housing matrix moduleaccording to an embodiment of the present disclosure;

FIG. 8 is an amplified schematic view of an A-A profile of the step typehousing matrix module of FIG. 8 according to an embodiment of thepresent disclosure;

FIG. 9 is a schematic view of a flat type housing matrix moduleaccording to an embodiment of the present disclosure;

FIG. 10 is an amplified schematic view of an A′-A′ profile of the flattype housing matrix module of FIG. 9 according to an embodiment of thepresent disclosure;

FIGS. 11A, 11B, 11C, 11D, 11E and 11F are schematic views of amanufacturing process according to an embodiment of the presentdisclosure;

FIGS. 12A, 12B and 12C are schematic views of a manufacturing processaccording to an embodiment of the present disclosure;

FIGS. 13A, 13B, 13C, 13D, 13E and 13F are schematic views of amanufacturing process according to an embodiment of the presentdisclosure;

FIGS. 14A, 14B and 14C are schematic views of a manufacturing processaccording to an embodiment of the present disclosure;

FIGS. 15A, 15B, 15C, 15D, 15E and 15F are schematic views of amanufacturing process according to an embodiment of the presentdisclosure;

FIGS. 16A, 16B, 16C, 16D, 16E and 16F are schematic views of amanufacturing process according to an embodiment of the presentdisclosure; and

FIGS. 17A and 17B are schematic views of affixing multiple housingmatrix modules to a tape.

DETAILED DESCRIPTION

FIG. 1 is a schematic sectional view of an embodiment of an opticalmodule 20 according to the present disclosure. The optical module 20includes a carrier 12, a lighting source 13, an optical sensor 14 and ahousing 25. The carrier 12 may be or may include, but is not limited to,substrates or printed circuit boards. The carrier 12 may be made of amaterial that can serve as a carrier. For example, the carrier 12 mayinclude, but is not limited to, organic materials, polymer materials,silicon, silicon dioxide or other silicides. Generally, the carrier 12has a thickness from approximately 50 micrometers (μm) to approximately1100 μm. A trace, a wire-bonding pad and/or a via may be included in thecarrier 12 or on the carrier 12.

The lighting source 13 and the optical sensor 14 are disposed at anupper surface 121 of the carrier 12. The lighting source 13 may be, forexample, a light emitting diode (LED), and the optical sensor 14 may be,for example, a photodiode.

The housing 25 is disposed at the upper surface 121 of the carrier 12,over the lighting source 13 and the optical sensor 14. The housing 25defines an aperture 251 corresponding to the lighting source 13 suchthat the lighting source 13 is exposed, and the housing 25 defines anaperture 252 corresponding to the optical sensor 14 such that theoptical sensor 14 is exposed. An adhesive 127 is filled between thehousing 25 and the lighting source 13 and between the housing 25 and theoptical sensor 14, and the adhesive extends to the carrier 12. Thehousing 25 is firmly affixed to the carrier 12 by the adhesive 127.

An outermost wall of the housing 25 includes an outer sidewall 253 withan inclined portion 2531 and a singulation portion 2533. The singulationportion 2533 is adjacent to the upper surface 121 of the carrier 12 andis substantially perpendicular to the upper surface 121 of the carrier12. A side 123 of the carrier 12 protrudes approximately 50 μm toapproximately 100 μm more than the singulation portion 2533; that is, adistance between two opposite sides 123 of the carrier 12 is greaterthan a distance between two opposite singulation portions 2533.

The substantially perpendicular singulation portion 2533 provides for areduced diameter of the housing 25 where the housing 25 attaches to thecarrier 12; thus, the optical module 20 may be reduced in size ascompared to a housing 25 in which the inclined portion 2531 extends to alower surface of the housing 25 where the housing 25 attaches to thecarrier 12. Additionally, as described below, multiple housings 25 areformed together in a single mold as a housing matrix module and latersingulated (resulting in the substantially perpendicular singulationportion 2533). Forming multiple housings 25 in a housing matrix moduleprovides for improved efficiency in transport (handling one molded pieceincorporating multiple housings 25 as compared to individual housings 25to be handled separately), improved efficiency and quality of inspection(inspecting one molded piece rather than separate pieces), reduceddamage (e.g., fewer exposed corners to damage), and reducedmanufacturing cost.

FIG. 2 is a schematic sectional view of an embodiment of an opticalmodule 30 according to the present disclosure. The optical module 30 issimilar to the optical module 20 in FIG. 1 , and a difference is thatoptical module 30 includes a housing 35 where at least one outersidewall 353 is substantially perpendicular to a lower surface of thehousing 35, omitting an inclined portion (e.g., the inclined portion2531 of the optical module 20 of FIG. 1 ).

FIG. 3 is a schematic sectional view of an embodiment of an opticalmodule 40 according to the present disclosure. The optical module 40 issimilar to the optical module 30 in FIG. 2 , and a difference is thatthe optical module 40 includes a housing 45 where, in the profile viewof FIG. 3 , at least one outer sidewall 453 of an outermost wall of thehousing 45 extends from a top surface of the housing 45 to a distanceabove the lighting source 13 and/or to a distance above the opticalsensor 14. That is, in the profile view depicted in FIG. 3 , the housing45 does not extend along a side of one or both of the lighting source 13and the optical sensor 14. It should be understood that the portion ofthe outermost wall corresponding to the outer sidewall 453 is connectedto the housing 45 in areas not illustrated in FIG. 3 .

FIG. 4 is a schematic sectional view of an embodiment of an opticalmodule 50 according to the present disclosure. The optical module 50 issimilar to the optical module 20 in FIG. 1 , and a difference is thatthe optical module 50 includes a housing 55, where a singulation portion5533 of an outer sidewall 553 of the housing 55 is substantiallycoplanar with a side 123 of the carrier 12. That is, a distance betweentwo opposite sides 123 of the carrier 12 is approximately equal to adistance between two opposite singulation portions 5533.

FIG. 5 is a schematic sectional view of an embodiment of an opticalmodule 60 according to the present disclosure. The optical module 60 issimilar to the optical module 30 in FIG. 2 , and a difference is thatthe optical module 60 includes a housing 65, where an outer sidewall 653of the housing 65 is substantially coplanar with a side 123 of thecarrier 12. That is, a distance between two opposite sides 123 of thecarrier 12 is approximately equal to a distance between two oppositeouter sidewalls 653 of the housing 65.

FIG. 6 is a schematic sectional view of an embodiment of an opticalmodule 70 according to the present disclosure. The optical module 70 issimilar to the optical module 40 in FIG. 3 , and a difference is thatthe optical module 70 includes a housing 75, where an outer sidewall 753of the housing 75 is substantially coplanar with a side 123 of thecarrier 12. That is, a distance between two opposite sides 123 of thecarrier 12 is approximately equal to a distance between two oppositeouter sidewalls 753 of the housing 75.

FIGS. 7 and 8 illustrate an example of a step type housing matrix module100 including multiple housings. For example, the housing matrix module100 may be used to form the housing 25 of the optical module 20 of FIG.1 or the housing 55 of the optical module 50 of FIG. 4. The housing 25of the optical module 20 is discussed with respect to FIGS. 7 and 8 byway of example (with references to component numbering as shown in FIG.1 ); however, it should be understood that the discussion applies alsoto the housing 55 of the optical module 50. FIG. 7 illustrates a topview of the housing matrix module 100 with multiple housings 25connected together. The housing matrix module 100 may be cut in aprocess of manufacturing the optical module 20, so that the housings 25are separated from each other to form individual housings 25. Theindividual housing 25 formed in this way is different in appearance froma housing made using a single-unit injection mold. A difference is thatthe housing 25 includes a singulation portion 2533. FIG. 8 is anamplified cross-sectional view along line A-A of FIG. 7 . As illustratedin FIG. 8 , between adjacent housings 25 in the housing matrix module100 there is a cut slot 110 with sloped sidewalls; a cutting tool maycut the housing matrix module 100 along the cut slots 110 to separatethe housing matrix module 100 into individual housings 25. The outersidewall 253 of the individual housing 25 includes the inclined portion2531 formed by the sloped sidewall of the cut slot 110, and the outersidewall 253 further includes the singulation portion 2533 formed duringcutting by the cutting tool. Because the singulation portion 2533 isformed during cutting, a surface of the singulation portion 2533 willexhibit cut marks (not shown), and is rougher than a surface formed byinjection molding (e.g., rougher than a surface of a housing formed by asingle-unit injection mold).

FIGS. 9 and 10 illustrate an example of a flat type housing matrixmodule 100′ including multiple housings. For example, the housing matrixmodule 100′ may be used to form the housing 35 of the optical module 30of FIG. 2 or the housing 65 of the optical module 60 of FIG. 5 . Thehousing 35 of the optical module 30 is discussed with respect to FIGS. 9and 10 by way of example (with references to component numbering asshown in FIG. 2 ); however, it should be understood that the discussionapplies also to the housing 65 of the optical module 60. FIG. 9illustrates a top view of the housing matrix module 100′ with multiplehousings 35 connected together. The housing matrix module 100′ may becut in a process of manufacturing the optical module 30, so that thehousings 35 are separated from each other to form individual housings35. The individual housing 35 formed in this way is different inappearance from a housing made using a single-unit injection mold. Adifference is that the housing 35 includes a singulated outer sidewall353. FIG. 10 is an amplified cross-sectional view along line A′-A′ ofFIG. 9 . As illustrated in FIG. 10 , between adjacent housings 35 in thehousing matrix module 100′ there is a solid portion; a cutting tool maycut the housing matrix module 100 through the solid portion to separatethe housing matrix module 100′ into individual housings 35. By thecutting, the outer sidewall 353 is defined; thus, the outer sidewall 353will exhibit cut marks (not shown), and is rougher than a surface formedby injection molding (e.g., rougher than a surface of a housing formedby a single-unit injection mold).

During a quality inspection, multiple housings 25 or 35 connected witheach other in the respective housing matrix module 100 or 100′ may beinspected together, reducing inspection time as compared to inspectingindividual housings formed by single-unit injection. Further, theinspection quality may be improved, as defects may be more readilyapparent in the housing matrix module 100 or 100′. Additionally, as thehousing matrix module 100 or 100′ includes respective connected multiplehousings 25 or 35, the housing matrix module 100 or 100′ may be morequickly, efficiently, and conveniently packed and transported; thus,packing and transport time and cost may be reduced.

FIGS. 11A-11F illustrate a process of making the optical module 20 shownin FIG. 1 . In FIGS. 11A-11B, one or more step type housing matrixmodules 100 are affixed to a tape 600 (which may be a strip orwafer-shaped). In FIG. 11B, a cutting machine (not shown) cuts thehousing matrix module 100 along cut slots 110 to form multipleindividual housings 25, but the cutting is controlled to avoid cuttingthe tape 600, and the individual housings 25 remain attached to the tape600. In FIG. 11C, multiple lighting sources 13 and multiple opticalsensors 14 are disposed on an upper surface 121 of a carrier 12. Notethat disposing the lighting sources 13 and the optical sensors 14 on theupper surface 121 as shown in FIG. 11C may be performed prior to (andindeed, well in advance of) the stages shown in FIGS. 11A and 11B.Further, in one or more embodiments, bonding wires (not shown) may beused to electrically connect ones of the lighting sources 13 and theoptical sensors 14 to respective wire-bonding pads (not shown) on theupper surface 121 of the carrier 12. Referring again to FIG. 11C, thelighting sources 13 and the optical sensors 14 are fixed on the uppersurface 121 of the carrier 12, such as with a transparent moldingmaterial (molding compound). Referring still to FIG. 11C, an adhesive127 is coated on portions of the upper surface 121 of the carrier 12. InFIG. 11D, the individual housings 25 are removed from the tape 600 andpositioned on the upper surface 121 of the carrier 12 (e.g., by a pickand place technique using a die bonder). The individual housings 25 arepositioned such that each housing 25 covers one or more of the lightingsources 13 and one or more of the optical sensors 14. The adhesive 127is heated to a curing temperature and the curing temperature maintainedfor a period of time sufficient to cure the adhesive 127. In FIG. 11E, acutting tool (not shown) is used to cut the carrier 12 along cuttinglines (e.g., the dotted line in FIG. 11E). Thereby, multiple opticalmodules 20 are formed, as illustrated in FIG. 11F.

FIGS. 12A-12C illustrate an additional process of making the opticalmodule 20 as shown in FIG. 1 . Similar to FIGS. 11A-11B, in FIGS.12A-12B, one or more step type housing matrix modules 100 are affixed toa wafer-shaped tape 600; and in FIG. 12B, a cutting machine (not shown)cuts the housing matrix module 100 along cut slots 110 to form multipleindividual housings 25, but the cutting is controlled to avoid cuttingthe tape 600, and the individual housings 25 remain attached to the tape600. Then, in FIG. 12C, the tape 600 is transversely stretched andexpanded to increase a distance between adjacent ones of the housings 25(which are still affixed to the tape 600), such that separating thehousings 25 from the tape 600 (e.g., by a pick and place technique usinga die bonder) is more convenient and efficient. Following the stageillustrated in FIG. 12C, multiple lighting sources 13, optical sensors14 and housings 25 are disposed on the carrier 12 and the carrier iscut, similarly as described with respect to FIGS. 11C-11F.

Regarding the manufacturing processes of the optical module 20 asdisclosed in FIGS. 11A-11F and 12A-12C, multiple individual housings 25formed by cutting the housing matrix module 100 are fixed on the carrier12, and subsequently the carrier 12 is cut to form multiple opticalmodules 20; therefore, the side 123 of the carrier 12 of the opticalmodule 20 may protrude more than the singulation portion 2533 of thehousing 25, as illustrated in FIG. 1 .

Also regarding the manufacturing processes of the optical module 20 asdisclosed in FIGS. 11A-11F and 12A-12C, because the individual housings25 are formed by cutting the housing matrix module 100, a wall thicknessof an outermost wall of the housing 25 can be designed to be as thin asdesired. By way of comparison, walls of a housing formed in asingle-unit injection mold have a minimum width imposed by the injectionmolding process used; further, the shape of a single-unit injection moldhousing may include walls inclined from a top surface of the housing toa bottom surface of the housing to facilitate ejection of the housingfrom the mold, and the inclined walls should have a minimum thickness atthe narrowest point (generally, 0.15 mm or greater) to avoid breakageduring ejection. The housing 25 thus can be designed and manufactured tohave a small diameter as compared to a housing made by single-unitinjection molding. For example, the outermost wall of the housing 25 atthe singulation portion 2533 can have a thickness less thanapproximately 0.15 mm, and it has been found that a wall thickness ofapproximately 0.075 mm does not result in breakage of the housing 25.

FIGS. 13A-13F illustrate a process of making the optical module 30 shownin FIG. 2 . In FIGS. 13A-13B, one or more flat type housing matrixmodules 100′ are affixed to a tape 600 (which may be a strip orwafer-shaped). In FIG. 13B, a cutting machine (not shown) cuts thehousing matrix module 100 along cut slots 110 to form multipleindividual housings 35, but the cutting is controlled to avoid cuttingthe tape 600, and the individual housings 35 remain attached to the tape600. In FIG. 13C, multiple lighting sources 13 and multiple opticalsensors 14 are disposed on an upper surface 121 of a carrier 12. Notethat disposing the lighting sources 13 and the optical sensors 14 on theupper surface 121 as shown in FIG. 13C may be performed prior to (andindeed, well in advance of) the stages shown in FIGS. 13A and 13B.Further, in one or more embodiments, bonding wires (not shown) may beused to electrically connect ones of the lighting sources 13 and theoptical sensors 14 to respective wire-bonding pads (not shown) on theupper surface 121 of the carrier 12. Referring again to FIG. 13C, thelighting sources 13 and the optical sensors 14 are fixed on the uppersurface 121 of the carrier 12, such as with a transparent moldingmaterial (molding compound). Referring still to FIG. 13C, an adhesive127 is coated on portions of the upper surface 121 of the carrier 12. InFIG. 13D, the individual housings 35 are removed from the tape 600 andpositioned on the upper surface 121 of the carrier 12 (e.g., by a pickand place technique using a die bonder). The individual housings 35 arepositioned such that each housing 35 covers one or more of the lightingsources 13 and one or more of the optical sensors 14. The adhesive 127is heated to a curing temperature and the curing temperature maintainedfor a period of time sufficient to cure the adhesive 127. In FIG. 13E, acutting tool (not shown) is used to cut the carrier 12 along cuttinglines (e.g., the dotted line in FIG. 13E). Thereby, multiple opticalmodules 30 are formed, as shown in FIG. 13F.

FIGS. 14A-14C illustrate an additional process of making the opticalmodule 30 as shown in FIG. 2 . Similar to FIGS. 13A-13B, in FIGS.14A-14B, one or more flat type housing matrix modules 100 are affixed toa wafer-shaped tape 600; and in FIG. 14B, a cutting machine (not shown)cuts the housing matrix module 100 along cut slots 110 to form multipleindividual housings 35, but the cutting is controlled to avoid cuttingthe tape 600, and the individual housings 35 remain attached to the tape600. Then, in FIG. 14C, the tape 600 is transversely stretched andexpanded to increase a distance between adjacent ones of the multiplehousings 35 (which are still affixed to the tape 600), such thatseparating the housings 35 from the tape 600 (e.g., by a pick and placetechnique using a die bonder) is more convenient and efficient.Following the stage illustrated in FIG. 14C, multiple lighting sources13, optical sensors 14 and housings 25 are disposed on the carrier 12and the carrier is cut, similarly as described with respect to FIGS.13C-13F.

Regarding the manufacturing processes of the optical module 30 disclosedin FIGS. 13A-13F and 14A-14C, multiple individual housings 35 formed bycutting the housing matrix module 100′ are fixed on the carrier 12, andsubsequently the carrier 12 is cut to form multiple optical modules 20;therefore, the side 123 of the carrier 12 of the optical module 30 mayprotrude more than the outer sidewall 353 of the housing 35, asillustrated in FIG. 2 .

Also regarding the manufacturing processes of the optical module 30disclosed in FIGS. 13A-13F and 14A-14C, because the individual housings35 are formed by cutting the housing matrix module 100′, a wallthickness of an outermost wall of the housing 35 can be designed to beas thin as desired. The housing 35 thus can be designed and manufacturedto have a small diameter as compared to a housing made by single-unitinjection molding. For example, the outermost wall of the housing 35 canhave a thickness less than approximately 0.15 mm, and it has been foundthat a wall thickness of approximately 0.075 mm does not result inbreakage of the housing 35.

The wall thickness of the outermost wall of the respective housing 25 or35 can be made as thin as desired using the processes in FIGS. 11A-11F,12A-12C, 13A-13F and 14A-14C. The wall thickness may be equal to zero,such that the optical module 40 in FIG. 3 is made. It should be notedthat, with respect to the optical module 40 in FIG. 3 , the portion 453is connected elsewhere on the housing 45, in a portion other than shownin the profile view of FIG. 3 .

A benefit of the processes of FIGS. 11A-11F, 12A-12C, 13A-13F and14A-14C is that a pick and place technique may be used to remove thehousings 25 or 35 from the tape 600 and place the housings 25 or 35 onthe carrier 12, as compared to feeding single-unit injection housingsthrough a bowl feeder. Thus, collisions of the housings with foreignmaterials or other housings or devices in the bowl feeder, which cancause damage to the housings, is avoided. Additionally, the processes ofFIGS. 11A-11F, 12A-12C, 13A-13F and 14A-14C are faster than the use ofthe bowl feeder, and are more precise in terms of both picking (therebyavoiding a mechanical gripper scratching the housings) and placing. Themanufacturing processes of FIGS. 12A-12C and 14A-14C, in which the tape600 is stretched and expanded to further distance the housings 25 or 35from each other, can make the pick-and-place operation more efficient.

FIGS. 15A-15F illustrate a process of making the optical module 50 shownin FIG. 4 . In FIGS. 15A-15B, one or more step type housing matrixmodules 100 are affixed to a tape 600 (which may be a strip orwafer-shaped). In one or more embodiments, the tape 600 is affixed to atop surface of the housing matrix module 100, and covers a cut slot 110.In FIG. 15C, multiple lighting sources 13 and multiple optical sensors14 are disposed on an upper surface 121 of a carrier 12. Note thatdisposing the lighting sources 13 and the optical sensors 14 on theupper surface 121 as shown in FIG. 15C may be performed prior to (andindeed, well in advance of) the stages shown in FIGS. 15A and 15B.Further, in one or more embodiments, bonding wires (not shown) may beused to electrically connect ones of the lighting sources 13 and theoptical sensors 14 to respective wire-bonding pads (not shown) on theupper surface 121 of the carrier 12. Referring again to FIG. 15C, thelighting sources 13 and the optical sensors 14 are fixed on the uppersurface 121 of the carrier 12, such as with a transparent moldingmaterial (molding compound). Referring still to FIG. 15C, an adhesive127 is coated on portions of the upper surface 121 of the carrier 12. InFIG. 15D, the housing matrix module 100 affixed to the tape 600 isaffixed to the upper surface 121 of the carrier 12, and the housings 55are positioned such that each housing 55 covers one or more of thelighting sources 13 and one or more of the optical sensors 14. Theadhesive 127 is heated to a curing temperature and the curingtemperature maintained for a period of time sufficient to cure theadhesive 127. In FIG. 15E, the tape 600 is removed, and a cutting tool(not shown) is used to cut the housing matrix module 100 and the carrier12 along cutting lines (e.g., the dotted line in FIG. 15E). Thereby, asshown in FIG. 15F, multiple optical modules 50 are formed.

Regarding the manufacturing process of the optical module 50 disclosedin FIGS. 15A-15F, because the housing matrix module 100 is first affixedto the carrier 12, and then the housing matrix module 100 and thecarrier 12 are cut to form multiple optical modules 50, a side 123 ofthe carrier 12 of the optical module 50 is substantially coplanar with asingulation portion 5533 of the housing 55 (referring to FIG. 4 ),allowing for a reduced diameter of the housing 55 and a correspondingreduced diameter of the optical module 50.

Also regarding the manufacturing processes of the optical module 50disclosed in FIGS. 15A-15F, because the individual housings 55 areformed by cutting the housing matrix module 100, a wall thickness of anoutermost wall of the housing 55 can be designed to be as thin asdesired. The housing 55 thus can be designed and manufactured to have asmall diameter as compared to a housing made by single-unit injectionmolding. For example, the outermost wall of the housing 55 can have athickness less than approximately 0.15 mm, and it has been found that awall thickness of approximately 0.075 mm does not result in breakage ofthe housing 55.

FIGS. 16A-16F illustrate a process of making the optical module 60 shownin FIG. 5 . In FIGS. 16A-16B, one or more flat type housing matrixmodules 100′ are affixed to a tape 600 (which may be a strip orwafer-shaped). In one or more embodiments, the tape 600 is affixed to atop surface of the housing matrix module 100′. In FIG. 16C, multiplelighting sources 13 and multiple optical sensors 14 are disposed on anupper surface 121 of a carrier 12. Note that disposing the lightingsources 13 and the optical sensors 14 on the upper surface 121 as shownin FIG. 16C may be performed prior to (and indeed, well in advance of)the stages shown in FIGS. 16A and 16B. Further, in one or moreembodiments, bonding wires (not shown) may be used to electricallyconnect ones of the lighting sources 13 and the optical sensors 14 torespective wire-bonding pads (not shown) on the upper surface 121 of thecarrier 12. Referring again to FIG. 16C, the lighting sources 13 and theoptical sensors 14 are fixed on the upper surface 121 of the carrier 12,such as with a transparent molding material (molding compound).Referring still to FIG. 16C, an adhesive 127 is coated on portions ofthe upper surface 121 of the carrier 12. In FIG. 16D, the housing matrixmodule 100′ affixed to the tape 600 is affixed to the upper surface 121of the carrier 12, and the housings 65 are positioned such that eachhousing 65 covers one or more of the lighting sources 13 and one or moreof the optical sensors 14. The adhesive 127 is heated to a curingtemperature and the curing temperature maintained for a period of timesufficient to cure the adhesive 127. In FIG. 16E, the tape 600 isremoved, and a cutting tool (not shown) is used to cut the housingmatrix module 100′ and the carrier 12 along cutting lines (e.g., thedotted line in FIG. 16E). Thereby, as shown in FIG. 16F, multipleoptical modules 60 are formed.

Regarding the manufacturing process of the optical module 60 in FIGS.16A-16F, because the housing matrix module 100′ is first affixed to thecarrier 12, and then the housing matrix module 100′ and the carrier 12are cut to form multiple optical modules 60, a side 123 of the carrier12 of the optical module 60 is substantially coplanar with a sidewall753 of the housing 65 (referring to FIG. 5 ), allowing for a reduceddiameter of the housing 65 and the optical module 60.

Also regarding the manufacturing processes of the optical module 60disclosed in FIGS. 16A-16F, because the individual housings 65 areformed by cutting the housing matrix module 100′, a wall thickness of anoutermost wall of the housing 65 can be designed to be as thin asdesired. The housing 65 thus can be designed and manufactured to have asmall diameter as compared to a housing made by single-unit injectionmolding. For example, the outermost wall of the housing 65 can have athickness less than approximately 0.15 mm, and it has been found that awall thickness of approximately 0.075 mm does not result in breakage ofthe housing 65.

The wall thickness of the outermost wall of the respective housing 55 or65 can be made as thin as desired using the processes in FIGS. 15A-15Fand 16A-16F. The wall thickness may be equal to zero, such that theoptical module 70 in FIG. 6 is made.

A benefit of the processes of FIGS. 15A-15F and 16A-16F is that thehousing matrix module 100 or 100′ including multiple housings 55, 65 or75 may be assembled onto the carrier 12 as a unit, as compared tofeeding single-unit injection housings through a bowl feeder. Thus,collisions of the housings with foreign materials or other housings ordevices in the bowl feeder, which can cause damage to the housings, isavoided. Additionally, the processes of FIGS. 15A-15F and 16A-16F arefaster than the use of the bowl feeder, and are more precise in terms ofplacing the housings 55, 65 or 75 accurately.

FIGS. 17A-17B illustrate that, for the manufacturing processes disclosedin FIGS. 11A-11F, 12A-12C, 13A-13F, 14A-14C, 15A-15F and 16A-16F,multiple housing matrix modules 100 or 100′ can be affixed to a tape,followed by the subsequent stages of making the respective opticalmodules 20, 30, 40, 50, 60 or 70. In FIG. 17A, multiple positioningmarks 710 are marked on a jig 700, and multiple housing matrix modules100 or 100′ are placed on the jig 700 and are respectively aligned withthe multiple positioning marks 710. In FIG. 17B, a tape 800 is bonded tothe multiple housing matrix modules 100 or 100′. The tape 800 isillustrated as being formed of a clear material; however, tape 800 maybe another material. The tape 800 is an example of the tape 600 of theprocesses described above. Subsequently to FIG. 17B, manufacturingcontinues as described with respect to FIG. 11B-11F, 12B-12C, 13B-13F,14B-14C, 15C-15F or 16C-16F.

Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,”“down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,”“lower,” “upper,” “over,” “under,” and so forth, are indicated withrespect to the orientation shown in the figures unless otherwisespecified. It should be understood that the spatial descriptions usedherein are for purposes of illustration only, and that practicalimplementations of the structures described herein can be spatiallyarranged in any orientation or manner, provided that the merits ofembodiments of this disclosure are not deviated by such arrangement.

As used herein, the terms “substantially” and “approximately” are usedto describe and account for small variations. When used in conjunctionwith an event or circumstance, the terms can refer to instances in whichthe event or circumstance occurs precisely as well as instances in whichthe event or circumstance occurs to a close approximation. For example,when used in conjunction with a numerical value, the terms can refer toa range of variation of less than or equal to ±10% of that numericalvalue, such as less than or equal to ±5%, less than or equal to ±4%,less than or equal to ±3%, less than or equal to ±2%, less than or equalto ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, orless than or equal to ±0.05%.

For example, “substantially perpendicular” can refer to a range ofvariation of less than or equal to ±10% of 9°, such as less than orequal to ±5%, less than or equal to ±4%, less than or equal to ±3%, lessthan or equal to ±2%, less than or equal to ±1%, less than or equal to±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

Two surfaces can be deemed to be coplanar or substantially coplanar if adisplacement between the two surfaces is no greater than 5 μm, nogreater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.

Two (positive) numerical values can be deemed to be approximately equalif a difference between the values is less than or equal to 10% of anaverage of the values, such as less than or equal to 5%, less than orequal to 4%, less than or equal to 3%, less than or equal to 2%, lessthan or equal to 1%, less than or equal to 0.5%, less than or equal to0.1%, or less than or equal to 0.05%.

While the present disclosure has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations are not limiting. It should be understood by those skilledin the art that various changes may be made and equivalents may besubstituted without departing from the true spirit and scope of thepresent disclosure as defined by the appended claims. The illustrationsmay not necessarily be drawn to scale. There may be distinctions betweenthe artistic renditions in the present disclosure and the actualapparatus due to manufacturing processes and tolerances. There may beother embodiments of the present disclosure which are not specificallyillustrated. The specification and the drawings are to be regarded asillustrative rather than restrictive. Modifications may be made to adapta particular situation, material, composition of matter, method, orprocess to the objective, spirit and scope of the present disclosure.All such modifications are intended to be within the scope of the claimsappended hereto. While the methods disclosed herein have been describedwith reference to particular operations performed in a particular order,it will be understood that these operations may be combined,sub-divided, or re-ordered to form an equivalent method withoutdeparting from the teachings of the present disclosure. Accordingly,unless specifically indicated herein, the order and grouping of theoperations are not limitations.

What is claimed is:
 1. An optical module, comprising: a carrier; anoptical element disposed on an upper side of the carrier; a housingdisposed on the upper side of the carrier, wherein the housing definesan aperture exposing at least a portion of the optical element; and anadhesive disposed between the housing and the carrier, and between thehousing and the optical element; wherein the optical element comprisesan emitter and a receiver, and wherein the adhesive extends from alateral surface of the emitter to a lateral surface of the receiver. 2.The optical module of claim 1, wherein an outer sidewall of the housingcomprises at least one singulation portion disposed on the upper side ofthe carrier.
 3. The optical module of claim 2, wherein the adhesive isprotruded with respect to the singulation portion of the outer sidewallof the housing.
 4. The optical module of claim 2, wherein a lateralsurface of the carrier protrudes approximately 50 μm to approximately100 μm from the singulation portion of the housing, and wherein a wallthickness of the outer sidewall of the housing at the singulationportion ranges from 0.075 mm to 0.15 mm.
 5. The optical module of claim1, wherein, in a cross-sectional view, the adhesive covers at least twosides of the optical element.
 6. The optical module of claim 5, whereinthe adhesive contacts a lateral surface of the optical element.
 7. Theoptical module of claim 1, wherein the optical element comprises anemitter and a receiver, and wherein the emitter and the receiver areseparated from each other by the housing.
 8. The optical module of claim7, wherein the adhesive is arranged underneath a portion of the housingbetween the emitter and the receiver.
 9. The optical module of claim 8,wherein the adhesive encapsulates three surfaces of the housing.
 10. Theoptical module of claim 1, wherein the adhesive contacts the emitter,the receiver and the housing.
 11. The optical module of claim 1, whereinan outer sidewall of the housing comprises at least one singulationportion disposed on the upper side of the carrier, wherein, in across-sectional view, the adhesive covers at least two sides of theoptical element, wherein the optical element comprises an emitter and areceiver, and wherein the emitter and the receiver are separated fromeach other by the housing, and wherein the adhesive extends from alateral surface of the emitter to a lateral surface of the receiver.